JPH0421821Y2 - - Google Patents
Info
- Publication number
- JPH0421821Y2 JPH0421821Y2 JP15278186U JP15278186U JPH0421821Y2 JP H0421821 Y2 JPH0421821 Y2 JP H0421821Y2 JP 15278186 U JP15278186 U JP 15278186U JP 15278186 U JP15278186 U JP 15278186U JP H0421821 Y2 JPH0421821 Y2 JP H0421821Y2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- baskets
- jig
- basket
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 65
- 235000012431 wafers Nutrition 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000007788 liquid Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15278186U JPH0421821Y2 (en]) | 1986-10-02 | 1986-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15278186U JPH0421821Y2 (en]) | 1986-10-02 | 1986-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6360472U JPS6360472U (en]) | 1988-04-22 |
| JPH0421821Y2 true JPH0421821Y2 (en]) | 1992-05-19 |
Family
ID=31071070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15278186U Expired JPH0421821Y2 (en]) | 1986-10-02 | 1986-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421821Y2 (en]) |
-
1986
- 1986-10-02 JP JP15278186U patent/JPH0421821Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6360472U (en]) | 1988-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI384582B (zh) | 基板支撐單元及其基板處理設備 | |
| KR102731360B1 (ko) | 기판 처리 장치 | |
| US6340090B1 (en) | Substrate fixturing device | |
| JPH0421821Y2 (en]) | ||
| JPH01120828A (ja) | 半導体ウエハの自動洗浄装置 | |
| TWI604522B (zh) | Semiconductor wafer cleaning method and device | |
| US20060196530A1 (en) | Novel semiconductor wafer lifter | |
| JP3325135B2 (ja) | 基板処理装置およびそれに用いられる処理槽 | |
| JPS6242372B2 (en]) | ||
| CN109326550B (zh) | 一种芯片清洗装置 | |
| JP2000031108A (ja) | ウエハ洗浄・乾燥装置及びウエハの洗浄・乾燥方法 | |
| KR100978127B1 (ko) | 기판 처리장치 및 이의 기판 이송 방법 | |
| JP2000243807A (ja) | 基板処理装置 | |
| CN217007078U (zh) | 刻蚀硅片用保持装置以及刻蚀硅片用系统 | |
| CN218554955U (zh) | 一种提升半导体晶舟清洗效率的装置 | |
| CN218175110U (zh) | 材料表面处理装置 | |
| KR101066594B1 (ko) | 기판 처리 장치, 이의 노즐 셋팅 방법 및 이를 이용한 기판처리 방법 | |
| JP2840799B2 (ja) | 枚葉式洗浄方法及び装置 | |
| JP3748016B2 (ja) | 基板処理装置 | |
| CN207966924U (zh) | 一种芯片双层冲水篮 | |
| JP3600747B2 (ja) | 基板処理装置 | |
| KR0178000B1 (ko) | 웨이퍼의 세정 장치 | |
| JPH0411511Y2 (en]) | ||
| JPH0661209A (ja) | 洗浄装置及びこれを用いた半導体ウエハなどの基板の洗浄方法 | |
| JP3600746B2 (ja) | 基板処理装置 |